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  ? semiconductor components industries, llc, 2005 august, 2005 ? rev. 3 1 publication order number: nuf6105fc/d nuf6105fc 6 channel emi pi?filter array with esd protection this device is a 6 channel emi filter array for data lines. greater than ?35 db attenuation is obtained at frequencies from 800 mhz to 2.2 ghz. it also offers esd protection ? clamping transients from static discharges to protect delicate data line circuitry. features ? emi filtering and esd protection for data lines ? integration of 30 discretes offers cost and space savings ? exceeds iec61000?4?2 (level 4) specifications ? low profile flip?chip packaging ? msl 1 ? pb?free package is available typical applications ? emi filtering and esd protection for data lines ? cell phones ? handheld portables ? notebook computers ? mp3 players maximum ratings (t a = 25 c) rating symbol value unit esd discharge iec61000?4?2, ? air discharge ? contact discharge human body model v pp 30 30 16 kv dc power per resistor p r 100 mw dc power per package p t 600 mw junction temperature t j 150 c operating temperature range t op ?40 to +85 c storage temperature range t stg ?55 to +150 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. device package shipping ? ordering information nuf6105fct1 flip?chip 3000/tape & ree l circuit description http://onsemi.com r1 a1 c1 d1 c1 c2 d2 r2 a2 c2 d3 c3 c4 d4 b1 r3 a3 c3 d5 c5 c6 d6 r4 a4 c4 d7 c7 c8 d8 b2 r5 a5 c5 d9 c9 c10 d10 r6 a6 c6 d11 c11 c12 d12 b3 flip?chip case 499d plastic a1 nuf6105ayww   marking diagram a = assembly location y = year ww = work week  = pb?free package (note: microdot may be in either location) ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. NUF6105FCT1G flip?chip (pb?free) 3000/tape & ree l
nuf6105fc http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) symbol characteristic min typ max unit v rwm maximum reverse working voltage ? ? 5.0 v v br i z = 10 ma 6.0 7.0 8.0 v i r v rwm = 3.3 v per line ? ? 0.1  a r i/o i r = 20 ma 80 100 120  c d v r = 2.5 v, f = 1 mhz (note 1 and 2) ? 27 ? pf 1. measured at 25 c, v r = 2.5 v, f = 1.0 mhz. 2. total line capacitance is 2 times the diode capacitance (c d ). typical performance curves (t a = 25 c unless otherwise specified) ?50 ?45 ?40 ?35 ?30 ?25 ?20 ?15 ?10 ?5 0 10 100 1000 10000 figure 1. insertion loss curve (s21 measurement) frequency (mhz) s21 (db) ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 0 10 100 1000 10000 figure 2. analog crosstalk curve (s41 measurement) frequency (mhz) s41 (db) channel 1 or channel 6 channel 2 or channel 5 channel 3 or channel 4 channel 1 to channel 2 channel 3 to channel 4 temperature ( c) resistance (  ) 95 96 97 98 99 100 101 102 103 104 105 ?40 ?15 10 35 60 85 0 0.5 1.0 1.5 2.0 0 1.0 2.0 3.0 4.0 5.0 reverse voltage (v) normalized capacitance figure 3. typical capacitance vs. reverse biased voltage (normalized capacitance cd at 2.5 v) figure 4. resistance over temperature
nuf6105fc http://onsemi.com 3 figure 5. esd scope trace human body model (?8 kv)  : 900 v @: ?900 v  : 6.92 v @: 6.92 v figure 6. esd scope trace human body model (+8 kv)
nuf6105fc http://onsemi.com 4 printed circuit board recommendations parameter 500  m pitch 300  m solder ball pcb pad size 250  m +25 250  m ?0 pad shape round pad type nsmd solder mask opening 350  m 25 solder stencil thickness 125  m stencil aperture 250 x 250  m sq. solder flux ratio 50/50 solder paste type no clean type 3 or finer trace finish osp cu trace width 150  m max figure 7. solder mask versus non?solder mask definition figure 8. solder reflow profile 5 4 3 2 1 0 time (minutes) 250 200 150 100 50 0 temperature ( c) 1 to 2 min 30?100 sec controlled atmosphere 225 c min 235 c max 1 to 5 c/s 140 to 160 c 183 c 2 to 5 c/s copper solder mask nsmd smd
nuf6105fc http://onsemi.com 5 package dimensions 15 pin flipchip csp case 499d?01 issue o seating plane 0.10 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeter. 3. coplanarity applies to spherical crowns of solder balls. 4 x dim a min max ??? millimeters a1 a2 0.380 0.430 d 2.960 bsc e b 0.290 0.340 e 0.500 bsc 0.700 d e a b terminal a1 locator d1 e1 e1 e a 0.05 b c 0.03 c 0.05 c 15 x b 12345 c b a 0.10 c a a1 a2 c 0.210 0.270 1.330 bsc e1 0.435 bsc d1 0.870 bsc e1 2.500 bsc 6 e /2
nuf6105fc http://onsemi.com 6 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, r epresentation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 nuf6105fc/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.


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